NPI Lead - Photonics

NPI Lead (Photonics – New Product Introduction) | Palo Alto, California | Hybrid | up to $200k

Are you a hands-on, data-driven engineer with a passion for innovation?

Do you thrive at the intersection of cutting-edge design and high-volume manufacturing?

If so, we have an exciting opportunity for you.

We’re looking for a New Product Introduction (NPI) Lead to spearhead the development and industrialization of our advanced Silicon Photonics products.

In this role, you’ll be the go-to technical expert in assembly and packaging processes—playing a pivotal role in translating next-generation designs into scalable, production-ready solutions.

This is more than just a technical role—this is your chance to shape the future of photonic manufacturing.
 
Responsibilities:

• Own Process Development – Lead the design, characterization, and optimization of critical processes like precision die bonding, wire bonding, and optical alignment.
• Enable High-Volume Manufacturing (HVM) – Define equipment specs, design custom tooling, and qualify processes for seamless scale-up.
• Implement SPC & DOE – Use advanced statistical methods to monitor process health, drive yield improvements, and ensure process stability.
• Master Silicon Photonics Assembly – Tackle complex packaging challenges involving fiber attach, thermal management, and high-density interconnects.
• Drive Design for Manufacturability (DFM) – Collaborate with design teams to ensure products are optimized for robust, high-yield production.
• Boost Yields – Lead root cause analyses and implement corrective/preventative actions to hit and exceed yield targets.
• Lead Manufacturing Transfers – Develop detailed documentation and manage the technical transfer of processes to contract manufacturing (CM) partners.

Skills & Experience:

• A minimum of a Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related field with Master’s or PhD preferred.
• 5+ years of experience in NPI or process engineering within semiconductor, electronics, or photonics packaging.
• Hands-on experience in assembly processes: die bonding, wire bonding, optical alignment.
• Expertise in Silicon Photonics packaging.
• Strong command of SPC, DOE, and statistical tools for manufacturing optimization.

• Track record of ramping processes from R&D to high-volume manufacturing.
• Deep materials knowledge (epoxies, solders) and process characterization expertise.
• Experience with automation equipment and process qualification.
• Proficiency with statistical software (JMP, Minitab).
• Experience working with offshore CMs.
• Strong analytical, problem-solving, and communication skills.

What’s in it for you?

• Salary up to $200k DOE.
• Hybrid working.
• Bonus 10%-20%.
• Equity DOE.
• Medical and Dental.