Packaging Engineer

Packaging Engineer (Onsite – Portugal)
Location: Aveiro District, Portugal (Onsite)
Salary: €50,000 - €70,000 (flexible for exceptional candidates)
 
We are recruiting a Photonics Packaging Engineer to join an innovative, advanced-technology company developing next-generation optoelectronic solutions.
 
This position offers the opportunity to work on cutting-edge photonic integrated module technologies in a highly collaborative engineering environment. The successful candidate will play a key technical role in developing robust assembly and packaging processes that support scalable, high-performance optical products.
 
Key Responsibilities:

• Develop, refine, and maintain assembly processes for advanced optoelectronic modules.
• Support packaging activities involving photonic and electronic components such as lasers, photonic integrated circuits, and detectors.
• Drive process optimisation focused on alignment precision, thermal-mechanical reliability, manufacturability, and production yield.
• Design and implement optical alignment and fibre attachment methods, including passive and active alignment techniques.
• Conduct optical and electrical performance evaluation of packaged modules, including insertion loss, back reflection, and functional verification.

 
Required Experience & Qualifications:

• Degree in Electrical Engineering, Photonics, Physics, Materials Science, Mechanical Engineering, or a related technical discipline.
• 5+ years of hands-on experience in photonic, optoelectronic, semiconductor, or advanced electronics packaging environments.
• Experience with either Flip-chip assembly, wire or ribbon bonding, or Optical alignment.
• Experience performing optical and electrical characterisation at the module or subsystem level.

 
Benefits:

• Salary: €50,000 - €70,000 (flexible for exceptional candidates)
• Full benefits packages – Pension, holiday allowance, etc.
• Work on advanced semiconductor technologies