Reference:BH-2488
Sector:Electrical Engineering, Photonics / Opto
Salary:$250,000 to $270,000 Per Annum
Benefits:Bonus + Equity
Town/City:Santa Clara
Contract Type:Permanent
Principal Module & Failure Analysis Lead | Photonics
Location: Santa Clara, CA
Salary: $250K - $270K
I’m working with an innovative photonics company developing next-generation optical technologies for AI and high-performance computing. They’re looking for a Principal Module & FA Lead to own module integration and system-level failure analysis as they scale towards volume production.
Key responsibilities:
What they're looking for:
Photonics, optical packaging, fiber coupling, die attach, or wire bonding experience would be a strong advantage.
Location: Santa Clara, CA
Salary: $250K - $270K
I’m working with an innovative photonics company developing next-generation optical technologies for AI and high-performance computing. They’re looking for a Principal Module & FA Lead to own module integration and system-level failure analysis as they scale towards volume production.
Key responsibilities:
- Lead module integration across mechanical, electrical, thermal, firmware, and optical/photonics domains.
- Drive complex, cross-functional failure analysis and root-cause investigations.
- Apply structured problem-solving techniques, including DOE, fishbone analysis, and first-principles modelling.
- Establish integration procedures, FA processes, documentation, and tracking systems.
- Drive corrective actions through to actual design and process improvements.
- Support the transition from pre-production into high-volume contract manufacturing.
What they're looking for:
- BS +15 / MS +12 / PhD +9 years in systems engineering, hardware failure analysis, or related disciplines.
- Strong cross-domain hardware knowledge and hands-on troubleshooting experience.
- Proven experience leading complex root-cause investigations and practical DOE.
- Ability to develop first-principles models and work across multiple engineering disciplines.
- Track record of driving corrective actions and building processes from the ground up.
Photonics, optical packaging, fiber coupling, die attach, or wire bonding experience would be a strong advantage.
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