Principal III-V Photonic Chip Engineering Lead

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Reference:BH-2338

Sector:Electrical Engineering

Salary:£150,000 to £250,000 Per Annum

Benefits:Bonus + Stock Options

Town/City:Fremont

Contract Type:Permanent

Principal III-V Photonic Chip Engineering Lead - Bay Area
$150,000 – $250,000 + Bonus + Stock Options

A leading optical communications company is hiring a Principal-level engineer to lead the development of advanced III-V photonic chips for next-generation data centre and AI applications.

The Role:
You will drive end-to-end development — from epitaxy and device design through fabrication, testing, and production — working closely with external foundries and cross-functional teams.


Key Responsibilities
  • Design III-V epitaxial structures (MQWs, waveguides)
  • Develop high-speed devices (DFB lasers, EAM/MZM, photodetectors)
  • Design and simulate photonic integrated circuits (PICs)
  • Optimise fabrication processes with foundry partners
  • Lead testing, data analysis, and performance improvement
  • Collaborate with packaging and system teams

Requirements

  • MSc or PhD in Electrical Engineering, Physics, Semiconductor Devices, or related field
  • Deep expertise in III-V materials, epitaxy, device physics, and fabrication
  • Proven leadership in at least one of the following:
    • ≥100 mW DFB lasers (O-band or C-band), or
    • ≥100 Gb/s electro-absorption modulators (EML/EAM/MZM)
  • Strong simulation and modelling skills (optical + RF + device physics)
  • Hands-on experience with device testing and characterisation
  • Experience working with external foundries and driving process optimisation

Compensation

  • $150,000 – $250,000 base salary
  • Bonus
  • Stock options / equity participation
  • Full benefits package

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